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Next-generation mask strategy: are technologies ready for mass production of 256 MDRAM? Summary of Photomask Japan '97 Panel Discussion
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Paper Abstract

A panel discussion on mask technologies for 0.2-micrometer rule devices was held at Photomask Japan '97. This paper summarizes the discussion to make clear what is really needed to the mask, and what is a key issue to overcome. Required CD uniformity is satisfied by the improvement in resist/etching process and pattern writing accuracy. PSM key issues are defect inspection and repair. OPC is indispensable for 0.2 micrometer device, so the improvement in mask pattern fidelity and defect inspection technology is strongly required, but some limitation in OPC pattern design will be necessary to realize the OPC technology in mass production. To achieve both technology and cost, the partnership of captive and merchant mask shop, and the partnership of lithography, device, mask, equipment, and material vendors will be very important.

Paper Details

Date Published: 12 February 1997
PDF: 2 pages
Proc. SPIE 3236, 17th Annual BACUS Symposium on Photomask Technology and Management, (12 February 1997); doi: 10.1117/12.301189
Show Author Affiliations
Hiroaki Morimoto, Mitsubishi Electric Corp. (Japan)
Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)
Hideaki Hamada, Etec Systems Japan Ltd. (Japan)

Published in SPIE Proceedings Vol. 3236:
17th Annual BACUS Symposium on Photomask Technology and Management
James A. Reynolds; Brian J. Grenon, Editor(s)

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