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Proceedings Paper

Improved image acquistion for advanced reticle inspection
Author(s): Yair Eran; Gad Greenberg; Avner Segev
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Paper Abstract

The ability to inspect sub-micron features is an essential need for the manufacturing of advanced reticles. The shrinking of the minimal line width and the need for detecting smaller defects present a challenge for die-to-database reticle inspection. To meet this challenge, Orbot-Applied has developed an improved image acquisition (IIA) method and integrated it into its new RT-8000ES Die-to-Database reticle inspection system. The introduction of the IIA module made possible the detection of smaller defects and the ability to inspect smaller features, while maintaining all the other advantages of the field proven RT-8000 system. The evaluation of the RT-8000ES performance included scanning special test reticles with sub-micron features, containing different types of programmed defects of varying sizes. The evaluations's results show the RT-8000ES has the ability to inspect advanced reticles with lines down to 0.6 micron in width, while detecting defects as small as 0.15 microns, with no false defects. With this new improved image acquisition capability, the RT-8000ES has the ability to inspect current and future advanced reticles with high defect detection sensitivity and high reliability.

Paper Details

Date Published: 12 February 1997
PDF: 10 pages
Proc. SPIE 3236, 17th Annual BACUS Symposium on Photomask Technology and Management, (12 February 1997); doi: 10.1117/12.301181
Show Author Affiliations
Yair Eran, Orbot Instruments Ltd. (Israel)
Gad Greenberg, Orbot Instruments Ltd. (Israel)
Avner Segev, Orbot Instruments Ltd. (Israel)

Published in SPIE Proceedings Vol. 3236:
17th Annual BACUS Symposium on Photomask Technology and Management
James A. Reynolds; Brian J. Grenon, Editor(s)

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