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Proceedings Paper

DNA-assisted microassembly: a hetrogeneous integration technology for optoelectronics
Author(s): Sadik C. Esener; Daniel M. Hartmann; Michael J. Heller; Jeffrey M. Cable
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Paper Abstract

The integration of optoelectronic and electronic components from different origins and substrates makes possible many advanced systems in diverse applications in photonics. To this end, various hybrid integration technologies including flip-chip bonding, epitaxial lift-off and direct bonding, substrate removal and “applique” bonding, microrobotic pick and place, and self-assembly methods have been explored. In this paper, we will briefly describe and evaluate these approaches for their applications in optoelectronics and focus on a new micro-assembly technology that can pick, place, and bond many devices of different origins and dimensions simultaneously in a parallel fashion on very large surfaces. We will present some of our preliminary results demonstrating the feasibility of this DNA-assisted micro-assembly technique.

Paper Details

Date Published: 27 January 1998
PDF: 28 pages
Proc. SPIE 10292, Heterogeneous Integration: Systems on a Chip: A Critical Review, 1029208 (27 January 1998); doi: 10.1117/12.300616
Show Author Affiliations
Sadik C. Esener, Univ. of California, San Diego (United States)
Daniel M. Hartmann, Univ. of California, San Diego (United States)
Michael J. Heller, Nanotronics Inc. (United States)
Jeffrey M. Cable, Nanotronics Inc. (United States)

Published in SPIE Proceedings Vol. 10292:
Heterogeneous Integration: Systems on a Chip: A Critical Review
Anis Husain; Mahmoud Fallahi, Editor(s)

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