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Proceedings Paper

Fusion bonding: hetero-interfacial materials analysis and device application
Author(s): K. A. Black; Aaron R. Hawkins; Near M. Margalit; Dubravko I. Babic; Archie L. Holmes; Ying-Lan Chang; P. Abraham; John Edward Bowers; Evelyn L. Hu
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Paper Abstract

A large number of novel devices have been recently demonstrated using wafer fusion to integrate materials with different lattice constants. In many cases, devices created using this technique have shown dramatic improvements over those which maintain a single lattice constant. We present device results and characterizations of the fused interface between several groups of materials.

Paper Details

Date Published: 27 January 1998
PDF: 26 pages
Proc. SPIE 10292, Heterogeneous Integration: Systems on a Chip: A Critical Review, 1029204 (27 January 1998); doi: 10.1117/12.300613
Show Author Affiliations
K. A. Black, Univ. of California, Santa Barbara (United States)
Aaron R. Hawkins, Univ. of California, Santa Barbara (United States)
Near M. Margalit, Univ. of California, Santa Barbara (United States)
Dubravko I. Babic, Univ. of California, Santa Barbara (United States)
Archie L. Holmes, Univ. of California, Santa Barbara (United States)
Ying-Lan Chang, Univ. of California, Santa Barbara (United States)
P. Abraham, Univ. of California, Santa Barbara (United States)
John Edward Bowers, Univ. of California, Santa Barbara (United States)
Evelyn L. Hu, Univ. of California, Santa Barbara (United States)


Published in SPIE Proceedings Vol. 10292:
Heterogeneous Integration: Systems on a Chip: A Critical Review
Anis Husain; Mahmoud Fallahi, Editor(s)

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