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Proceedings Paper

Instrumental monitoring and nondestructive evaluation of highway bridges
Author(s): Victor J. Hunt; Ahmet Turer; Yong Gao; Alper Levi; Arthur J. Helmicki; Raymond A. Barrish; Fikret Nacati Catbas; Kirk A. Grimmelsman; A. Emin Aktan
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Paper Abstract

On-line, continuous monitoring technologies of a rigorous and objective nature are sought to quantitatively identify and evaluate the condition or health of highway structures over their useful lifetime. A global bridge evaluation methodology is under development based upon the structural identification concept, employing modal testing, truckload testing, and instrumented monitoring as its principal experimental tools. Test results are transformed to either modal flexibility or the unit influence line, which have been demonstrated to be conceptual, quantitative, comprehensive, and damage-sensitive signatures. Four test sites were tested, monitored, and studied in order to classify their similar bride-type-specific behavior mechanisms and to validate the performance of the implemented methodology. Practical, type-specific procedures for instrumented monitoring and nondestructive evaluation can then be developed for the whole group or type of highway bridges.

Paper Details

Date Published: 31 March 1998
PDF: 10 pages
Proc. SPIE 3400, Structural Materials Technology III: An NDT Conference, (31 March 1998); doi: 10.1117/12.300119
Show Author Affiliations
Victor J. Hunt, Univ. of Cincinnati (United States)
Ahmet Turer, Univ. of Cincinnati (United States)
Yong Gao, Univ. of Cincinnati (United States)
Alper Levi, Univ. of Cincinnati (United States)
Arthur J. Helmicki, Univ. of Cincinnati (United States)
Raymond A. Barrish, Drexel Intelligent Infrastructure Institute (United States)
Fikret Nacati Catbas, Drexel Intelligent Infrastructure Institute (United States)
Kirk A. Grimmelsman, Drexel Intelligent Infrastructure Institute (United States)
A. Emin Aktan, Drexel Intelligent Infrastructure Institute (United States)


Published in SPIE Proceedings Vol. 3400:
Structural Materials Technology III: An NDT Conference
Ronald D. Medlock; David C. Laffrey, Editor(s)

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