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Proceedings Paper

Benefits of continuous deflection profile analysis: a case study of runway 17R-35L at Dallas/Fort Worth International Airport using the rolling dynamic deflectometer
Author(s): Tracy A. Turen; Terry Dossey; B. Frank McCullough
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Paper Abstract

A research project was undertaken by the The University of Texas at Austin's Center for Transportation Research to assess the condition and remaining life of a large section of Runway (RW) 17R-35L and taxiway L at Dallas/Fort Worth International Airport. Concrete fatigue was determined from fatigue testing of RW core samples and from deflection data obtained from an experimental testing device called the Rolling Dynamic Deflectometer (RDD). The RDD is a truck-mounted device that measures continuous deflection profiles of pavements. The RDD appears to be a very promising device for use in pavement performance analysis. The RDD gives much more comprehensive deflection data than devices currently in use such as the Falling Weight Deflectometer and the Dynaflect and the data collection procedure is quicker and more efficient. Additionally, continuous deflection profiles provide more ways of assessing the in-place structural adequacy of pavements. For this research, RDD data from one section approximately 305 m (1000 ft.) was selected to illustrate several possible ways to analyze the data. Due to the large amount of data collected by sampling every 152 mm (6 in.) on a runway over a mile in length, a program called RDD3 was developed to perform the analysis. Results of this analysis are presented here.

Paper Details

Date Published: 31 March 1998
PDF: 15 pages
Proc. SPIE 3400, Structural Materials Technology III: An NDT Conference, (31 March 1998); doi: 10.1117/12.300102
Show Author Affiliations
Tracy A. Turen, Transtec Inc. (United States)
Terry Dossey, Univ. of Texas/Austin (United States)
B. Frank McCullough, Univ. of Texas/Austin (United States)


Published in SPIE Proceedings Vol. 3400:
Structural Materials Technology III: An NDT Conference
Ronald D. Medlock; David C. Laffrey, Editor(s)

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