Share Email Print
cover

Proceedings Paper

Tunneling microscopic study of submicroscopic defects on the surfaces of loaded metals
Author(s): Victor I. Vettegren; Sohibnasar Sh. Rakhimov; Vladimir N. Svetlov
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Load-induced submicroscopic defects of the surfaces metals were studied with a scanning tunnelling microscope. The methodological aspects of microscopy investigation of loaded metal samples in air and nitrogen were examined in detail. Defects shaped like in a print of a triangular prism are observed to form on the surface of polished and annealed samples of Cu, Au, Mo and Pd. Original defects were 5, 15, 22 and 18 nm deep on surfaces of Pd, Cu, Au and Mo and 50 - 100 nm wide and long. The vertex angles of prism were approximately equals 700 in Pd, Au and Cu surfaces and approximately equals 500 or approximately equals 900 on Mo surfaces. Concentrations of the defects grows, reaches a maximum value and decreases. Then there are emerged new defects which depth is 2 - 3 times more than the original one. Their concentration grows, reaches a maximum value and decreases. The following type of defects of larger sizes create on the surface, their concentration grows, reaches a new maximum value and decreases, and so on. All defects have the form much like the original defects and their deep is a multiple the original defect deep.

Paper Details

Date Published: 1 January 1998
PDF: 6 pages
Proc. SPIE 3345, International Workshop on New Approaches to High-Tech Materials: Nondestructive Testing and Computer Simulations in Materials Science and Engineering, (1 January 1998); doi: 10.1117/12.299600
Show Author Affiliations
Victor I. Vettegren, A.F. Ioffe Physical-Technical Institute (Russia)
Sohibnasar Sh. Rakhimov, A.F. Ioffe Physical-Technical Institute (Russia)
Vladimir N. Svetlov, A.F. Ioffe Physical-Technical Institute (Russia)


Published in SPIE Proceedings Vol. 3345:
International Workshop on New Approaches to High-Tech Materials: Nondestructive Testing and Computer Simulations in Materials Science and Engineering
Alexander I. Melker, Editor(s)

© SPIE. Terms of Use
Back to Top