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Proceedings Paper

Integrated optics toward the third dimension
Author(s): Christoph A. Waechter; Th. Hennig; Th. Bauer; Andreas H. Braeuer; Wolfgang Karthe
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Paper Abstract

The level of integration within standard waveguide devices is usually restricted to the use of a single plane per wafer containing waveguides. Recently, concepts for waveguide structures with several planes of waveguides gain some special interest. They are mainly due to intentions to increase the number of channels per chip, to reduce the chip size and to improve device characteristics. Dense vertical stacking of waveguides turns out to be an approach to 3D integrated optics, which is within the resolution limits of up-to-date waveguide technologies. Theoretical and experimental results for 3D directional couplers are reported in detail.

Paper Details

Date Published: 12 January 1998
PDF: 10 pages
Proc. SPIE 3278, Integrated Optic Devices II, (12 January 1998); doi: 10.1117/12.298189
Show Author Affiliations
Christoph A. Waechter, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Th. Hennig, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Th. Bauer, Fraunhofer-Institut fuer Angewandte Optik un Feinmechanik (Germany)
Andreas H. Braeuer, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Wolfgang Karthe, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)


Published in SPIE Proceedings Vol. 3278:
Integrated Optic Devices II
Giancarlo C. Righini; S. Iraj Najafi; Bahram Jalali, Editor(s)

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