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Proceedings Paper

Optical sensor of a probing system for inspection of PCBs
Author(s): Jae Hong Shim; Hyungsuck Cho; Sang-Ho Kim
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Paper Abstract

We have developed a highly responsible probing system for inspection of electrical properties of assembled PCBs. However, as the duration of the impact occurring between a probe and a solder joint on PCB is very short, it is very difficult to control the harmful peak impact force and the slip motion of the probe to sufficient level only by its force feedback control with high gains. To overcome these disadvantages of the prototype, it needs to obtain some information of the solder joint in advance before the contact. In addition, to guarantee the reliability of the probing task, the probing system is required to measure several points around the probable target point at high sped. Therefore, to meet such requirements, we propose a new non-contact sensor capable of detecting simultaneously position and normal vectors of the multiple points around the probable target point in real time. By using this information, we can prepare a control strategy for stable contact motion on impact. In this paper, we described measuring principle, design, and development of the sensor. The effectiveness of the proposed sensor is verified through a series of experiments.

Paper Details

Date Published: 2 January 1998
PDF: 9 pages
Proc. SPIE 3201, Sensors and Controls for Advanced Manufacturing, (2 January 1998); doi: 10.1117/12.298024
Show Author Affiliations
Jae Hong Shim, Korea Advanced Institute of Science and Technology (South Korea)
Hyungsuck Cho, Korea Advanced Institute of Science & Technology (South Korea)
Sang-Ho Kim, Samsung Electronics, Ltd. (South Korea)


Published in SPIE Proceedings Vol. 3201:
Sensors and Controls for Advanced Manufacturing

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