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Proceedings Paper

Modularized microelectromechanical devices as key components for advanced intelligent autonomous sensors and control systems
Author(s): Matthias Schuenemann; Volker Grosser; Rudolf Leutenbauer; Peter Matuscheck; Wolfgang Schaefer; Herbert Reichl
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Paper Abstract

A highly flexible, modular design and production framework for microelectromechanical systems, suitable for mid-scale production at reasonable costs, is presented. The modulator framework, similar to unit construction system well-known in the macro world, consists of a manufacturer set and an application kit. It allows for considerable reduction of design and production expenditure while retaining maximum technical flexibility. The feasibility of the modular approach is demonstrated by the presentation and discussion of a novel modular vertical integration technique.

Paper Details

Date Published: 2 January 1998
PDF: 16 pages
Proc. SPIE 3201, Sensors and Controls for Advanced Manufacturing, (2 January 1998); doi: 10.1117/12.298007
Show Author Affiliations
Matthias Schuenemann, Fraunhofer-Institute for Manufacturing Engineering and Automation (Australia)
Volker Grosser, Fraunhofer-Institute for Mechanical Reliability and Microintegration (Germany)
Rudolf Leutenbauer, Fraunhofer-Institute for Mechanical Reliability and Microintegration (Germany)
Peter Matuscheck, Fraunhofer-Institute for Manufacturing Engineering and Automation (Germany)
Wolfgang Schaefer, Fraunhofer-Institute for Manufacturing Engineering and Automation (Germany)
Herbert Reichl, Fraunhofer-Institute for Mechanical Reliability and Microintegration (Germany)


Published in SPIE Proceedings Vol. 3201:
Sensors and Controls for Advanced Manufacturing
Bartholomew O. Nnaji; Anbo Wang, Editor(s)

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