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Proceedings Paper

Pad polishing for rapid production of large flats
Author(s): Ralph R. Berggren; Rodney A. Schmell
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Paper Abstract

Pad polishing is an efficient technique for polishing-out a ground surface and reaching a figure better than one wave, ready for completion with less than an hour on a planetary polisher. Recent work has shown success on 350 mm square parts; current work involves scaling the process to 1.4 meter diameter. For the 350 mm square piece of BK7, removal was one micrometer every 10 minutes. Polishing-out from a 5 micrometer grind took less than 3 hours, to a surface smoothness of one nm rms. Other tests verified that the pad leaves no unusual subsurface damage. Following completion on a pitch planetary polisher, surface finish is the same as obtained for conventional processing.

Paper Details

Date Published: 1 November 1997
PDF: 6 pages
Proc. SPIE 3134, Optical Manufacturing and Testing II, (1 November 1997); doi: 10.1117/12.295131
Show Author Affiliations
Ralph R. Berggren, Los Alamos National Lab. (United States)
Rodney A. Schmell, Los Alamos National Lab. (United States)


Published in SPIE Proceedings Vol. 3134:
Optical Manufacturing and Testing II
H. Philip Stahl, Editor(s)

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