Share Email Print

Proceedings Paper

Pad polishing for rapid production of large flats
Author(s): Ralph R. Berggren; Rodney A. Schmell
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Pad polishing is an efficient technique for polishing-out a ground surface and reaching a figure better than one wave, ready for completion with less than an hour on a planetary polisher. Recent work has shown success on 350 mm square parts; current work involves scaling the process to 1.4 meter diameter. For the 350 mm square piece of BK7, removal was one micrometer every 10 minutes. Polishing-out from a 5 micrometer grind took less than 3 hours, to a surface smoothness of one nm rms. Other tests verified that the pad leaves no unusual subsurface damage. Following completion on a pitch planetary polisher, surface finish is the same as obtained for conventional processing.

Paper Details

Date Published: 1 November 1997
PDF: 6 pages
Proc. SPIE 3134, Optical Manufacturing and Testing II, (1 November 1997); doi: 10.1117/12.295131
Show Author Affiliations
Ralph R. Berggren, Los Alamos National Lab. (United States)
Rodney A. Schmell, Los Alamos National Lab. (United States)

Published in SPIE Proceedings Vol. 3134:
Optical Manufacturing and Testing II
H. Philip Stahl, Editor(s)

© SPIE. Terms of Use
Back to Top