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Proceedings Paper

New vacuum packaging method of field emission display
Author(s): Byeong-Kwon Ju; Woo-Beom Choi; S. J. Jeong; Nam Young Lee; Jeong-In Han; K. I. Cho; Myung-Hwan Oh
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Paper Abstract

Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si- 7740 and Ti-(Li-doped SiO$02)) interlayer systems can be employed for the electrostatic bonding of 7059-7059 and 0080-0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

Paper Details

Date Published: 14 November 1997
PDF: 7 pages
Proc. SPIE 3242, Smart Electronics and MEMS, (14 November 1997); doi: 10.1117/12.293566
Show Author Affiliations
Byeong-Kwon Ju, Korea Institute of Science and Technology (South Korea)
Woo-Beom Choi, Korea Institute of Science and Technology (South Korea)
S. J. Jeong, Orion Electric Co., Ltd. (South Korea)
Nam Young Lee, Orion Electric Co., Ltd. (South Korea)
Jeong-In Han, Korea Electronics Technology Institute (South Korea)
K. I. Cho, Electronics and Telecommunications Research Institute (South Korea)
Myung-Hwan Oh, Korea Institute of Science and Technology (South Korea)


Published in SPIE Proceedings Vol. 3242:
Smart Electronics and MEMS
Alex Hariz; Vijay K. Varadan; Olaf Reinhold, Editor(s)

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