Share Email Print
cover

Proceedings Paper

Novel method for electroplating on silicon without the need of a continuous-plating base film
Author(s): Muralihar K. Ghantasala; Dinesh K. Sood
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper we present a novel method for selective electroplating on silicon without the need of using a continuous plating base film. Ion implantation on the polished front face of a silicon wafer is employed to induce selective seeding of electroplating. Silicon substrates have been implanted at RT with 19 keV Pd+ ions at several doses 7e14, 2e15, 1e16 and 1e17 ions/c,2 using a metal vapor vacuum arc ion implanter. These are then electroplated under similar bath conditions using a Ni-Fe plating solution to produce permalloy films. The unimplanted regions do not get plated showing the selective nature of this seeding process. Adhesion is better for films plated on substrates implanted at higher dose. To study the effect of implanted species, a silicon wafer was implanted with self ions and plated under similar conditions. This sample showed deposition of an extremely thin film. The potential of the technique has been demonstrated by patterning 50 and 100 (mu) wide metallic structures on silicon substrate.

Paper Details

Date Published: 14 November 1997
PDF: 7 pages
Proc. SPIE 3242, Smart Electronics and MEMS, (14 November 1997); doi: 10.1117/12.293558
Show Author Affiliations
Muralihar K. Ghantasala, Royal Melbourne Institute of Technology (Australia)
Dinesh K. Sood, Royal Melbourne Institute of Technology (Australia)


Published in SPIE Proceedings Vol. 3242:
Smart Electronics and MEMS
Alex Hariz; Vijay K. Varadan; Olaf Reinhold, Editor(s)

© SPIE. Terms of Use
Back to Top