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Proceedings Paper

Experimental investigation of the effects of compound angle holes on film cooling effectiveness and heat transfer performance using a transient liquid crystal thermometry technique
Author(s): David J. Seager; James A. Liburdy
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Paper Abstract

To further understand the effect of both compound angle holes and hole shaping on film cooling, detailed heat transfer measurements were obtained using hue based thermochromic liquid crystal method. The data were analyzed to measure both the full surface adiabatic effectiveness and heat transfer coefficient. The compound angles that were evaluated consist of holes that were aligned 0 degrees, 45 degrees, 60 degrees and 90 degrees to the main cross flow direction. Hole shaping variations from the traditional cylindrical shaped hole include forward diffused and laterally diffused hole geometries. Geometric parameters that were selected were the length to diameter ratio of 3.0, and the inclination angle 35 degrees. A density ratio of 1.55 was obtained for all teste. For each set of conditions the blowing ratio was varied to be 0.88, 1.25, and 1.88. Adiabatic effectiveness was obtained using a steady state test, while an active heating surface was used to determine the heat transfer coefficient using a transient method. The experimental method provides a unique method of analyzing a three-temperature heat transfer problem by providing detailed surface transport properties. Based on these results for the different hole geometries at each blowing ratio conclusions are drawn relative to the effects of compound angle holes on the overall film cooling performance.

Paper Details

Date Published: 21 November 1997
PDF: 9 pages
Proc. SPIE 3172, Optical Technology in Fluid, Thermal, and Combustion Flow III, (21 November 1997); doi: 10.1117/12.293412
Show Author Affiliations
David J. Seager, Clemson Univ. (United States)
James A. Liburdy, Clemson Univ. (United States)

Published in SPIE Proceedings Vol. 3172:
Optical Technology in Fluid, Thermal, and Combustion Flow III
Soyoung Stephen Cha; James D. Trolinger; Masaaki Kawahashi, Editor(s)

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