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Proceedings Paper

Quick kill passivation integrity study
Author(s): Karl Huber; Simon Gonzales
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Paper Abstract

This passivation integrity study was initiated as part of a submicron integration development program. New processes were developed which reflect a shrink in the device geometry's and significant changes in processes and equipment used. An immediate concern was the effect of these changes on the passivation integrity. To investigate these effects a series of passivation integrity tests were performed. Passivation failures were quantified via optical inspection and failure sources were identified by SEM analysis. The majority of the tests were performed on short flow processes (i.e. backend process flows consisting of 2 and 3 layer metal patterned structures). Full flow processes (integrated frontend and backend processes) were investigated on BiCMOS and CMOS technologies.

Paper Details

Date Published: 11 September 1997
PDF: 7 pages
Proc. SPIE 3216, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III, (11 September 1997); doi: 10.1117/12.284702
Show Author Affiliations
Karl Huber, Motorola (United States)
Simon Gonzales, Motorola (United States)

Published in SPIE Proceedings Vol. 3216:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III
Ali Keshavarzi; Sharad Prasad; Hans-Dieter Hartmann, Editor(s)

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