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Proceedings Paper

Die allocation optimization for yield improvement
Author(s): Carlos Ortega; Miguel Recio; Alfonso Urquia; Guillermo Sanchez; Ubaldo Nogal; Alfonso Badillo
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Paper Abstract

The way in which dies are allocated within a wafer is the subject of this paper. Standard ways of doing it are based on a software program, mainly in-house built, that uses default values for all the variables and do not take into account, in a direct mode, the actual distribution of yield versus distance to wafer edge in the manufacturing line where the chip is to be manufactured. We present a novel Software System for die allocation in the wafer, that uses an empirically obtained Yield Distribution Function (which gives the normalized yield for every X Y coordinate over the entire wafer area). The software developed gives as output the optimum die allocation in terms of yield.

Paper Details

Date Published: 11 September 1997
PDF: 5 pages
Proc. SPIE 3216, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III, (11 September 1997); doi: 10.1117/12.284690
Show Author Affiliations
Carlos Ortega, Lucent Technologies Madrid (Spain)
Miguel Recio, Lucent Technologies Madrid (Spain)
Alfonso Urquia, Lucent Technologies Madrid (Spain)
Guillermo Sanchez, Lucent Technologies Madrid (Spain)
Ubaldo Nogal, Lucent Technologies Madrid (Spain)
Alfonso Badillo, Lucent Technologies Madrid (Spain)

Published in SPIE Proceedings Vol. 3216:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III
Ali Keshavarzi; Sharad Prasad; Hans-Dieter Hartmann, Editor(s)

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