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Proceedings Paper

Automatic final inspection: an important nonexpensive control to guarantee long-term reliability
Author(s): Friedbald Kiel; Guiseppe Balbo; Eyal Duzi; Olga Andrianaivo-Golz; Thomas Kohnen
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Paper Abstract

After final electrical tests of microchips, an additional visual inspection is performed to guarantee their long term reliability. This step is time consuming and highly labour intensive. To reduce costs, and to improve at the same time the defect density monitoring using a higher sampling rate, the final visual inspection performed manually by operators, is replaced by an automatic inspection. This paper illustrates how the high sampling rate of a automatic final inspection may be used for better defect monitoring through final insulator layers, monitoring underlying metal layers as well.

Paper Details

Date Published: 11 September 1997
PDF: 7 pages
Proc. SPIE 3216, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III, (11 September 1997); doi: 10.1117/12.284687
Show Author Affiliations
Friedbald Kiel, Siemens SA (France)
Guiseppe Balbo, IBM SA (France)
Eyal Duzi, Orbot Instruments/Applied Materials Inc. (Israel)
Olga Andrianaivo-Golz, Siemens SA (France)
Thomas Kohnen, Siemens SA (France)

Published in SPIE Proceedings Vol. 3216:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III
Ali Keshavarzi; Sharad Prasad; Hans-Dieter Hartmann, Editor(s)

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