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Proceedings Paper

Advanced PVD Ti/TiN liners for contact and via applications
Author(s): Hans-Joachim Barth; J. Bierner; Hans Helneder; Werner K. Robl; K. Schober; Manfred Schneegans
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Paper Abstract

The benefits of different advanced PVD methods for Ti/TiN films, collimated, longthrow and ionized PVD, are compared to conventional or standard magnetron sputtering with respect to future requirements. Special attention is given to integration aspects in combination with W- plugs and hot Al-fill techniques for contact applications. Besides basic film properties and step coverage data, electrical results for contacts are reported. The dependence of the contact resistance on the bottom Ti thickness is explained, and a new spiking model for Al-filled contacts is proposed. Finally specific manufacturing issues like throughput, target life time and defect densities will be addressed also.

Paper Details

Date Published: 5 September 1997
PDF: 11 pages
Proc. SPIE 3214, Multilevel Interconnect Technology, (5 September 1997); doi: 10.1117/12.284651
Show Author Affiliations
Hans-Joachim Barth, Siemens AG (Germany)
J. Bierner, Siemens AG (Germany)
Hans Helneder, Siemens AG (Germany)
Werner K. Robl, Siemens AG (Germany)
K. Schober, Siemens AG (Germany)
Manfred Schneegans, Siemens AG (Germany)


Published in SPIE Proceedings Vol. 3214:
Multilevel Interconnect Technology
Divyesh N. Patel; Mart Graef, Editor(s)

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