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Proceedings Paper

Electrical characterization of FSG low K dielectric deposition in HDP and PECVD tools
Author(s): Gennadi Bersuker; Michael J. Shapiro; James Werking; Sang U. Kim
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Paper Abstract

Results on electrical characterization of test structures with fluorosilicate glass (FSG) deposited in four different chemical vapor deposition (CVD) tools are reported. Data demonstrate high sensitivity of the electrical properties of FSG to metal pattern density. Both dielectric constant and leakage current are shown to be critical parameters for evaluation of dielectric performance.

Paper Details

Date Published: 25 August 1997
PDF: 6 pages
Proc. SPIE 3213, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III, (25 August 1997); doi: 10.1117/12.284639
Show Author Affiliations
Gennadi Bersuker, SEMATECH (United States)
Michael J. Shapiro, SEMATECH (United States)
James Werking, SEMATECH (United States)
Sang U. Kim, SEMATECH (United States)


Published in SPIE Proceedings Vol. 3213:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III
Abe Ghanbari; Anthony J. Toprac, Editor(s)

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