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Proceedings Paper

CIM for 300-mm semiconductor fab
Author(s): Arthur Luk
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Paper Abstract

Five years ago, factory automation (F/A) was not prevalent in the fab. Today facing the drastically changed market and the intense competition, management request the plant floor data be forward to their desktop computer. This increased demand rapidly pushed F/A to the computer integrated manufacturing (CIM). Through personalization, we successfully reduced a computer size, let them can be stored on our desktop. PC initiates a computer new era. With the advent of the network, the network computer (NC) creates fresh problems for us. When we plan to invest more than $3 billion to build new 300 mm fab, the next generation technology raises a challenging bar.

Paper Details

Date Published: 25 August 1997
PDF: 9 pages
Proc. SPIE 3213, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III, (25 August 1997); doi: 10.1117/12.284634
Show Author Affiliations
Arthur Luk, Hyundai Semiconductor America, Inc. (United States)


Published in SPIE Proceedings Vol. 3213:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III
Abe Ghanbari; Anthony J. Toprac, Editor(s)

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