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Proceedings Paper

Thermal management in planar optical systems with active components
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Paper Abstract

Planar integrated free-space optics has been suggested and demonstrated as a micro-optical systems technology for optical interconnection and processing. It is based on the integration of micro-optical elements on a single glass substrate. Active optoelectronic components are mounted onto the substrate using hybrid integration techniques. An important problem related to the packaging is the heat removal from these active device arrays. A high interconnection density -- which is desirable from an architectural point of view -- can cause a dissipated power on the order of 100 W/cm2. This may compromise the performance of individual devices and the system as a whole. As cooling mechanisms, we consider convection which requires sufficiently large surfaces and conduction in an intermediate layer of high thermal conductivity between the passive optics and the optoelectronics. Both, structured silicon coolers and diamond layers are of interest for a practical realization. Here, we discuss material and design aspects of heat spreaders. Both, theoretical modeling and experimental results are presented. A test setup including an array of vertical cavity surface emitting lasers (VCSELs) is analyzed. The temperature distribution on the array is determined experimentally by the shift of the optical wavelength. Computer simulations are used to evaluate the experimental data.

Paper Details

Date Published: 2 September 1997
PDF: 11 pages
Proc. SPIE 3226, Microelectronic Structures and MEMS for Optical Processing III, (2 September 1997); doi: 10.1117/12.284574
Show Author Affiliations
Christiane Gimkiewicz, Fernuniv. Hagen (Germany)
Juergen Jahns, Fernuniv. Hagen (Germany)

Published in SPIE Proceedings Vol. 3226:
Microelectronic Structures and MEMS for Optical Processing III
M. Edward Motamedi; Hans Peter Herzig, Editor(s)

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