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Proceedings Paper

Analysis and enhancement of bond strength of acrylic sheets to metallic substrates for use in LIGA-type processing
Author(s): Supipta S. Das; Harish M. Manohara; Chantal G. Khan Malek
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Paper Abstract

In thick photoresist applications, commercially available acrylic sheets are bonded to a substrate as an alternative to the casting and in-situ polymerization of PMMA. The factors affecting the adhesion of a thick acrylic sheet to different substrates have been studied. In case of copper and titanium substrates and bond-strength can be improved by roughening the surface through chemical oxidation which then provides a mechanical interlocking between the resist and substrate surfaces. Annealing of PMMA sheet before gluing and use of adhesion promoter such as organosilane further improves the bond strength at the resist-substrate interface. The resist adhesion to various substrates is evaluated by measuring the debonded length of the acrylic sheet during a mechanical cleaving test.

Paper Details

Date Published: 2 September 1997
PDF: 6 pages
Proc. SPIE 3225, Microlithography and Metrology in Micromachining III, (2 September 1997); doi: 10.1117/12.284544
Show Author Affiliations
Supipta S. Das, Louisiana State Univ. (United States)
Harish M. Manohara, Louisiana State Univ. (United States)
Chantal G. Khan Malek, Louisiana State Univ. (United States)


Published in SPIE Proceedings Vol. 3225:
Microlithography and Metrology in Micromachining III
Craig R. Friedrich; Akira Umeda, Editor(s)

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