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Proceedings Paper

Low-cost reliable transfer mold sensor packaging concept
Author(s): Andre Bossche; Carmen V. B. Cotofana; P. Kaldenberg; I. Van Dommelen; Jeff R. Mollinger
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Paper Abstract

This paper presents a low-cost transfer mould packaging concept for sensors, based on a direct-mold principle.The advantage of this method is that up to the molding step the whole process is compatible with standard lead-frame processing. The molding concept and package structures allow plastic sensor packaging with one or more environmental access paths to be created in a single molding step. As an application of the new packaging concept, a plastic sensor package with a single access path has been developed for commercial production. The performances of this new low cost package are satisfactory and reliability tests show good results. Furthermore, packaging of other types of sensors is in preparation.

Paper Details

Date Published: 5 September 1997
PDF: 8 pages
Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); doi: 10.1117/12.284510
Show Author Affiliations
Andre Bossche, Delft Univ. of Technology (Netherlands)
Carmen V. B. Cotofana, Delft Univ. of Technology (Netherlands)
P. Kaldenberg, Eurasem B. V. (Netherlands)
I. Van Dommelen, Eurasem B.V. (Netherlands)
Jeff R. Mollinger, Delft Univ. of Technology (Netherlands)


Published in SPIE Proceedings Vol. 3224:
Micromachined Devices and Components III
Kevin H. Chau; Patrick J. French, Editor(s)

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