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Proceedings Paper

IC microtransducers: new components with old materials?
Author(s): Henry Baltes; Dirk Lange; Andreas Koll
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Paper Abstract

In the first part of this paper, we review the integration of MEMS and CMOS microtransducer technology and out-line the related IC MEMS CAD tools SOLIDIS and ICMAT. The IC microtransducer approach is illustrated by deflectable micromirrors, infrared sensors, and a thermally isolated n- well CMOS device. In the second part, we report two novel chemical microsensors based on CMOS MEMS technology: (i) a piezoresistive resonating beam with hydrocarbon-sensitive polymer layer and (ii) a microsystem chip including a piezoresistive and capacitive chemical sensors with co- integrated heating deice and circuitry.

Paper Details

Date Published: 5 September 1997
PDF: 12 pages
Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); doi: 10.1117/12.284502
Show Author Affiliations
Henry Baltes, ETH Zuerich (Switzerland)
Dirk Lange, ETH Zuerich (Switzerland)
Andreas Koll, ETH Zuerich (Switzerland)

Published in SPIE Proceedings Vol. 3224:
Micromachined Devices and Components III
Kevin H. Chau; Patrick J. French, Editor(s)

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