Share Email Print
cover

Proceedings Paper

IC microtransducers: new components with old materials?
Author(s): Henry Baltes; Dirk Lange; Andreas Koll
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In the first part of this paper, we review the integration of MEMS and CMOS microtransducer technology and out-line the related IC MEMS CAD tools SOLIDIS and ICMAT. The IC microtransducer approach is illustrated by deflectable micromirrors, infrared sensors, and a thermally isolated n- well CMOS device. In the second part, we report two novel chemical microsensors based on CMOS MEMS technology: (i) a piezoresistive resonating beam with hydrocarbon-sensitive polymer layer and (ii) a microsystem chip including a piezoresistive and capacitive chemical sensors with co- integrated heating deice and circuitry.

Paper Details

Date Published: 5 September 1997
PDF: 12 pages
Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); doi: 10.1117/12.284502
Show Author Affiliations
Henry Baltes, ETH Zuerich (Switzerland)
Dirk Lange, ETH Zuerich (Switzerland)
Andreas Koll, ETH Zuerich (Switzerland)


Published in SPIE Proceedings Vol. 3224:
Micromachined Devices and Components III
Kevin H. Chau; Patrick J. French, Editor(s)

© SPIE. Terms of Use
Back to Top