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Proceedings Paper

Precise micronanomachining for advanced sensors
Author(s): Masayoshi Esashi; Takahito Ono; Kazuyuki Minami
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Paper Abstract

Advanced silicon micro sensors for pressure, acceleration, angular rate, infrared radiation and atomic force have been developed based on bulk silicon micromachining. Distortion- free, precise or very small micro-nanostructures enables extremely sensitive and quick response sensors. Packaged, capacitive and integrated sensors were fabricated. Electrostatic force balancing sensors and resonant sensors performed wide dynamic range and high sensitivity respectively. Novel micromachining techniques developed and applied for the sensors were vacuum packaging, distortion-free anodic bonding, deep RIE, XeF2 silicon etching, thickness monitoring during silicon etching, silicon nano-wire growth by electric field evaporation using UHV STM etc.

Paper Details

Date Published: 5 September 1997
PDF: 12 pages
Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); doi: 10.1117/12.284499
Show Author Affiliations
Masayoshi Esashi, Tohoku Univ. (Japan)
Takahito Ono, Tohoku Univ. (Japan)
Kazuyuki Minami, Tohoku Univ. (Japan)


Published in SPIE Proceedings Vol. 3223:
Micromachining and Microfabrication Process Technology III
Shih-Chia Chang; Stella W. Pang, Editor(s)

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