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Proceedings Paper

Micromachining technology development in SIOFM
Author(s): Runwen Wang; Beijun Shen; Hao Ding
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Paper Abstract

In general liga technology must use the x ray from synchroclotron to radiate the material such as PMMA plane. It cannot utilize in common laboratory and research work in microelements fabrication of micromachining are inconvenient and expensive. Laser liga technology can be convenient to use, it effective developed in SIOFM in China. A pulse excimer laser with 248 nm wavelength and frequency-tetrad Nd:YAG laser with 265 nm wavelength through an optical uniformer and 10:1 projective lithophoton system for imaging the mask on the PMMA surface. Owing to cold ablation effect of UVU laser light, it can precise litho a reduce image with less than 1000 (mu) diameter and a 106 micrometer deep on PMMA surface. From experimental ablation curve which got by us and can choose the optimum condition for processing the microelement. SIOFM also developed a kind of microelement of cantilevel beam of GaAs with 3 micrometer thin. To radiate it with modulated semiconductor laser. A sinuous vibration with amplitude in order of micrometer and 105Hz frequency has been found. It can be used in modulating the micro-light beam and in multicanal fiber communication.

Paper Details

Date Published: 5 September 1997
PDF: 6 pages
Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); doi: 10.1117/12.284496
Show Author Affiliations
Runwen Wang, Shanghai Institute of Optics and Fine Mechanics (China)
Beijun Shen, Shanghai Institute of Optics and Fine Mechanics (China)
Hao Ding, Shanghai Institute of Optics and Fine Mechanics (China)

Published in SPIE Proceedings Vol. 3223:
Micromachining and Microfabrication Process Technology III
Shih-Chia Chang; Stella W. Pang, Editor(s)

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