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Proceedings Paper

Influence of processes and selective bonding technology
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Paper Abstract

The influences of surface characteristics, including adsorptive states led by different chemical treatments and surface roughness, on direct bonding between dissimilar CVD materials were investigated. The bonding procedures were carried out at temperature lower than 400 degrees Celsius. In this temperature range, LPCVD poly-silicon, PECVD oxide, and LPCVD silicon-nitride showed highly process dependent bonding behaviors, i.e., bondable or not bondable to another material under certain experimental conditions. Based on these facts, a selective bonding conception for Si-based CVD material is proposed and applied to fabricate new fluid structures and devices.

Paper Details

Date Published: 5 September 1997
PDF: 8 pages
Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); doi: 10.1117/12.284488
Show Author Affiliations
Jiwei Jiao, Technische Univ. Delft (Netherlands)
Axel Berthold, Technische Univ. Delft (Netherlands)
Michael J. Vellekoop, Technische Univ. Delft (Netherlands)
Patrick J. French, Technische Univ. Delft (Netherlands)


Published in SPIE Proceedings Vol. 3223:
Micromachining and Microfabrication Process Technology III
Shih-Chia Chang; Stella W. Pang, Editor(s)

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