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Proceedings Paper

Automotive applications for micromachining
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Paper Abstract

High volume silicon micromachining has been employed by the automotive industry for 20 years. This paper examines past, current and future applications of MEMS to the automobile. Both sensor and the application of micromachining to other automotive areas are covered. Technologies such as wet and plasma etching, wafer bonding, LIGA, circuit integration and packaging are discussed.

Paper Details

Date Published: 5 September 1997
PDF: 5 pages
Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); doi: 10.1117/12.284483
Show Author Affiliations
Douglas R. Sparks, Delco Electronics Corp. (United States)
Shih-Chia Chang, General Motors Research and Development Ctr. (United States)

Published in SPIE Proceedings Vol. 3223:
Micromachining and Microfabrication Process Technology III
Shih-Chia Chang; Stella W. Pang, Editor(s)

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