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Proceedings Paper

Macroporous silicon formation for micromachining
Author(s): Hiroshi Ohji; Sami Lahteenmaki; Patrick J. French
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Paper Abstract

This paper presents a new technique of micromachining using macro porous silicon. Macro porous silicon is made by electrochemical etching in hydrofluoric acid. The etch rate and the morphology of the etched surface as a function of etch parameters, (current density, applied voltage and HF concentration) are investigated. Optimization of these parameters makes it possible to fabricate a micromechanical structures such as 45 micrometer deep, 3 micrometer wide and 8 micrometer pitch trenches. Furthermore the diameter of the pore is easy to control by adjusting the current density. During the pore formation an increase in the current density leads to an increase in the pore diameter. This does not effect the diameter of existing pores. This connection of the pores under the structure can be achieved. In this way, various kinds of single crystal silicon micromachined structures can be fabricated.

Paper Details

Date Published: 5 September 1997
PDF: 9 pages
Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); doi: 10.1117/12.284480
Show Author Affiliations
Hiroshi Ohji, Technische Univ. Delft (Netherlands)
Sami Lahteenmaki, Helsinki Univ. of Technology (Finland)
Patrick J. French, Technische Univ. Delft (Netherlands)


Published in SPIE Proceedings Vol. 3223:
Micromachining and Microfabrication Process Technology III
Shih-Chia Chang; Stella W. Pang, Editor(s)

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