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Proceedings Paper

High-aspect-ratio etching in polymer for microactuator applications
Author(s): Wen Y. Lee; Junbo Gao; Toshiki Hirano; Susanna Chan; Long-Sheng Fan
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Paper Abstract

High aspect ratio line and trench plating molds suitable for microactuator applications were etched in polymer using oxygen plasma in an rf inductive plasma etcher. A high vertical etch rate of approximately equals 2.5 micrometer/min in a polymer has been achieved for 2 micrometer wide lines and trenches, with even higher rates being observed for wider trenches due to the usual RIE lag effect. The lateral etch rate can be reduced by adjusting the inductive to bias power ratio, and by lowering the etch temperatures. Under optimum etching conditions, aspect ratios of close to 20:1 in a 2.5 micrometer line/2.0 micrometer spacing pattern and of greater than 20:1 in isolated 2.0 micrometer lines with greater than or equal to 5 micrometer spacing have been achieved.

Paper Details

Date Published: 5 September 1997
PDF: 8 pages
Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); doi: 10.1117/12.284471
Show Author Affiliations
Wen Y. Lee, IBM Almaden Research Ctr. (United States)
Junbo Gao, IBM Almaden Research Ctr. (United States)
Toshiki Hirano, IBM Almaden Research Ctr. (United States)
Susanna Chan, IBM Almaden Research Ctr. (Hong Kong)
Long-Sheng Fan, IBM Almaden Research Ctr. (United States)


Published in SPIE Proceedings Vol. 3223:
Micromachining and Microfabrication Process Technology III
Shih-Chia Chang; Stella W. Pang, Editor(s)

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