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Proceedings Paper

Microcomposite electroforming for MEMS technology
Author(s): Shinn-Horng Yeh; Chun-Ying Liue; Ji-Weng Wang; Min-Chieh Chou; Shu-Ling Hou
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Paper Abstract

Composite electroforming is an electroplating technique basically. The ceramic or other type powder is mixed into electroforming solution, then codeposited with metal ion by using electroplating method. The codeposit is strengthen by the ceramic powder, which can be used for the application in MEMS field. We do the microcomposite electroforming research by using ultrafine (submicron or nano-sized) powder. The 20g/L silicon carbide powder added to nickel sulfamate electroforming solution can obtain the higher hardness and internal stress deposits (1.5 wt% SiC). Because high internal stress is harmful for electroforming process, it's necessary to take a suitable electrolyte and controlled condition for high hardness and low internal stress in microcomposite electroforming process.

Paper Details

Date Published: 5 September 1997
PDF: 9 pages
Proc. SPIE 3223, Micromachining and Microfabrication Process Technology III, (5 September 1997); doi: 10.1117/12.284468
Show Author Affiliations
Shinn-Horng Yeh, Industrial Technology Research Institute (Taiwan)
Chun-Ying Liue, Industrial Technology Research Institute (Taiwan)
Ji-Weng Wang, Industrial Technology Research Institute (Taiwan)
Min-Chieh Chou, Industrial Technology Research Institute (Taiwan)
Shu-Ling Hou, Industrial Technology Research Institute (Taiwan)

Published in SPIE Proceedings Vol. 3223:
Micromachining and Microfabrication Process Technology III
Shih-Chia Chang; Stella W. Pang, Editor(s)

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