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Proceedings Paper

Novel multilayer optical interconnection architecture using fiber pins
Author(s): Freddie Shing-Hong Lin; Guoda Xu; John M. Bartha; Tomasz P. Jannson
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Paper Abstract

This paper presents a new low-cost, multi-layer interconnection architecture, which has the potential of being utilized in a space environment. Instead of conventional electrical input/output (I/O) pins, optical I/O pins are used to provide multi-layer interconnection. A small vertical cavity surface emitting laser diode array and photodetector array are used to transmit and receive signals, respectively. A specially fabricated end-face lensed fiber array is utilized to provide high-speed, low-loss, and low-crosstalk signal transmission. By employing this new optical I/O pin architecture, many types of standard multi-layer interconnection can be easily realized. This presentation covers the main concepts, major components, fabrication procedures, and expected applications of this architecture.

Paper Details

Date Published: 24 October 1997
PDF: 11 pages
Proc. SPIE 3159, Algorithms, Devices, and Systems for Optical Information Processing, (24 October 1997); doi: 10.1117/12.284202
Show Author Affiliations
Freddie Shing-Hong Lin, Physical Optics Corp. (United States)
Guoda Xu, Physical Optics Corp. (United States)
John M. Bartha, Physical Optics Corp. (United States)
Tomasz P. Jannson, Physical Optics Corp. (United States)


Published in SPIE Proceedings Vol. 3159:
Algorithms, Devices, and Systems for Optical Information Processing
Bahram Javidi; Demetri Psaltis, Editor(s)

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