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Proceedings Paper

Machine vision for alignment and inspection in die bonder
Author(s): Satish Kolloor; S. Balamurugan
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Paper Abstract

Machine vision is widely used in die bonders to provide perfect alignment between the wafer or leadframe and the die pickup tip during pick and place operations respectively. This also results in better detection of bad ink-dotted dies and accurate placing of epoxy resin on the die bond pads of the leadframe. Pattern matching using Pattern Recognition techniques and area alignment using edge detection techniques are the two most widely used methods in providing die and leadframe pad alignment. The increased emphasis on quality improvement on semiconductor assembly has results in the use of machine vision for quality inspection in addition to alignment. The inspection is usually, done at two points in the die bond cycle, one just after epoxy application on the leadframe pad (pre-bond inspection) and the other after the die is bonded to the leadframe pad. The post bond inspect confirms if the placement of the die on the leadframe pad is within the required specification. It also looks for angular die placement as well as for epoxy spills on top of the die.

Paper Details

Date Published: 18 August 1997
PDF: 9 pages
Proc. SPIE 3185, Automatic Inspection and Novel Instrumentation, (18 August 1997); doi: 10.1117/12.284028
Show Author Affiliations
Satish Kolloor, Texas Instruments Singapore Pte. Ltd. (Singapore)
S. Balamurugan, Texas Instruments Singapore Pte. Ltd. (Singapore)


Published in SPIE Proceedings Vol. 3185:
Automatic Inspection and Novel Instrumentation
Anthony Tung Shuen Ho; Sreenivas Rao; Lee Ming Cheng, Editor(s)

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