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Proceedings Paper

Moire interferometry/termovision method for electronic package testing
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Paper Abstract

The method combining moire interferometry and termovision techniques (MI/T) for thermally loaded elements testing is proposed. The methodology of the MI/T method applied for simultaneous in-plane displacement/strain and temperature distributions monitoring and measurement at electronic elements is described. The results of thermal tests performed at electronic chip UCY74S405N are presented.

Paper Details

Date Published: 17 September 1997
PDF: 8 pages
Proc. SPIE 3098, Optical Inspection and Micromeasurements II, (17 September 1997); doi: 10.1117/12.281157
Show Author Affiliations
Leszek A. Salbut, Warsaw Univ. of Technology (Poland)
Malgorzata Kujawinska, Warsaw Univ. of Technology (Poland)


Published in SPIE Proceedings Vol. 3098:
Optical Inspection and Micromeasurements II
Christophe Gorecki, Editor(s)

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