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Proceedings Paper

Primary response of high-aspect-ratio thermoresistive sensors
Author(s): H. R. Majlesein; D. L. Mitchell; Pradeep Kumar Bhattacharya; A. Singh; James A. Anderson
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Paper Abstract

There is a growing need for sensors in monitoring performance in modern quality products such as in electronics to monitor heat build up, substrate delaminations, and thermal runaway. In processing instruments, intelligent sensors are needed to measure deposited layer thickness and resistivities for process control, and in environmental electrical enclosures, they are used for climate monitoring and control. A yaw sensor for skid prevention utilizes very fine moveable components, and an automobile engine controller blends a microprocessor and sensor on the same chip. An Active-Pixel Image Sensor is integrated with a digital readout circuit to perform most of the functions in a video camera. Magnetostrictive transducers sense and damp vibrations. Improved acoustic sensors will be used in flow detection of air and other fluids, even at subsonic speeds. Optoelectronic sensor systems are being developed for installation on rocket engines to monitor exhaust gases for signs of wear in the engines. With new freon-free coolants being available the problems of A/C system corrosion have gone up in automobiles and need to be monitored more frequently. Defense cutbacks compel the storage of hardware in safe-custody for an indeterminate period of time, and this makes monitoring more essential. Just-in-time customized manufacturing in modern industries also needs dramatic adjustment in productivity of various selected items, leaving some manufacturing equipment idle for a long time, and therefore, it will be prone to more corrosion, and corrosion sensors are needed. In the medical device industry, development of implantable medical devices using both potentiometric and amperometric determination of parameters has, until now, been used with insufficient micro miniaturization, and thus, requires surgical implantation. In many applications, high-aspect- ratio devices, made possible by the use of synchrotron radiation lithography, allow more useful devices to be produced. High-aspect-ratio sensors will permit industries and various other users to attain more accurate measurements of physical properties and chemical compositions in many systems. Considerable engineering research has recently been focused on this type of fabrication effect. This paper looks at a high-aspect-ratio sensor bus thermorestrictive device with increased aspect-ratio of the interconnects to the device, using unique simulation software resources.

Paper Details

Date Published: 28 July 1997
PDF: 7 pages
Proc. SPIE 3068, Signal Processing, Sensor Fusion, and Target Recognition VI, (28 July 1997); doi: 10.1117/12.280819
Show Author Affiliations
H. R. Majlesein, Southern Univ. (United States)
D. L. Mitchell, Southern Univ. (United States)
Pradeep Kumar Bhattacharya, Southern Univ. (United States)
A. Singh, Southern Univ. (United States)
James A. Anderson, Southern Univ. (United States)


Published in SPIE Proceedings Vol. 3068:
Signal Processing, Sensor Fusion, and Target Recognition VI
Ivan Kadar, Editor(s)

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