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Proceedings Paper

Optimizing thermal performance-cost trade-off
Author(s): Sambu Dakuginow; Roland Apides; Efren Lacap; Mark J. Berg
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Paper Abstract

Effective power dissipation in VLSI packaging has become a performance limiting criterion in small form factor, high performance hard disk drive applications. While potential solutions may exist, many come with unacceptable associated costs. Silicon systems and seagate technology is developed a program to identify suitable packaging solutions for the associated cost/performance tradeoff. For devices with power dissipation of 1W or less, the standard TQFP was the optimum choice. For power dissipation between 1W and 1.7W, a standard TQFP with leadfingers extending to the diepaddle is sufficient. For advanced generation devices running very near 2W, there are two possible solutions: a deep downset TQFP and a CBGA with thermal vias.

Paper Details

Date Published: 18 August 1997
PDF: 7 pages
Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); doi: 10.1117/12.280582
Show Author Affiliations
Sambu Dakuginow, Silicon Systems, Inc. (United States)
Roland Apides, Silicon Systems, Inc. (United States)
Efren Lacap, Silicon Systems, Inc. (United States)
Mark J. Berg, Seagate Technology (United States)

Published in SPIE Proceedings Vol. 3184:
Microelectronic Packaging and Laser Processing
Yong Khim Swee; HongYu Zheng; Ray T. Chen, Editor(s)

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