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Proceedings Paper

Reliability study of microelectronic packaging assemblies by a multiaxial submicron fatigue tester
Author(s): Sheng Liu; Minfu Lu; Zhengfang Qian; Wei Ren
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Paper Abstract

Existing mini testers are mostly single axial without any active specimen alignment monitoring and adjustment capability. Fundamental investigation for packaging materials needs to be conducted in terms of constitutive laws, fracture process, failure quantities. For the first time, specimen alignment monitoring and adjustment was demonstrated for a single lap shear sample by the 6-axis mini tester and its associated alignment monitoring and control system, assisted by a high resolution laser moire measurement. This paper presents results for two types of polyimide films, one led-free solder alloy, some other conventional materials, and a flip-chip assembly subjected to a three points bending. Various mechanisms of deformation and failure for both the materials and structures have been discussed. In particular, a new constitutive model for polymer films is also proposed in this paper.

Paper Details

Date Published: 18 August 1997
PDF: 8 pages
Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); doi: 10.1117/12.280581
Show Author Affiliations
Sheng Liu, Wayne State Univ. (United States)
Minfu Lu, Wayne State Univ. (United States)
Zhengfang Qian, Wayne State Univ. (United States)
Wei Ren, Wayne State Univ. (United States)


Published in SPIE Proceedings Vol. 3184:
Microelectronic Packaging and Laser Processing
Yong Khim Swee; HongYu Zheng; Ray T. Chen, Editor(s)

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