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Proceedings Paper

Excimer laser drilling of polymers
Author(s): Yihong Chen; HongYu Zheng; Terence Kin Shun Wong; Siu Chung Tam
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Paper Abstract

Laser micro-drilling technology plays a more and more important role in industry, especially in the fabrication of multi-layer electronic packages. In such applications, non- metals are often used as insulators, in which via holes are formed to provide vertical interconnections for densely packed 3D wiring networks. Mechanical punch tools have been the primary means to form holes in ceramic sheets and in polymer boards since the 1970's. As the cost of fabricating punch heads increases drastically and the demand for quick turn around part build becomes more routine, flexible via forming technologies, such as laser drilling, have become more prevalent. In laser drilling, CO2, Nd:YAG, and excimer lasers are often used. Their drilling capabilities, drilling mechanisms, and hole qualities are different because of the different laser beam characteristics such as wavelength and beam energy distribution. In this paper, the mechanisms of laser drilling are briefly reviewed. The results of the experiments on excimer laser drilling of two types of polymer: polyimide and polyethylene terephthalate, are reported. It is found that the etch rate increases with increase of fluence, an the wall angle of drilled holes is dependent on the fluence. The material removal by a laser pulse is highly controllable. There exists an optimal fluence range to obtain clean and smooth edges of quality holes for a given material at a given laser wavelength.

Paper Details

Date Published: 18 August 1997
PDF: 9 pages
Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); doi: 10.1117/12.280575
Show Author Affiliations
Yihong Chen, Gintic Institute of Manufacturing Technology (Singapore)
HongYu Zheng, Gintic Institute of Manufacturing Technology (Singapore)
Terence Kin Shun Wong, Gintic Institute of Manufacturing Technology (Singapore)
Siu Chung Tam, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 3184:
Microelectronic Packaging and Laser Processing
Yong Khim Swee; HongYu Zheng; Ray T. Chen, Editor(s)

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