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Proceedings Paper

Developments of optimum flip-chip bonding process
Author(s): Dong Hyeon Jang; Sa Yoon Kang; Y. M. Lee; S. Y. Oh
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Paper Abstract

Flip-chip soldering is the critical technology for solving the current issues of electronic packaging industries that require the high I/O's. In order to increase the manufacturing ability of flip-chip technology, however, yield and reliability tissues should overcome. In this study, optimum flip-chip bonding process has been developed by using the test chips that had the electroplated solder bumps. Test chips are composed of three different types that are i) peripheral array pad chip, ii) peripheral array pad chip, and iii) area array pad chip. Each test chip has the daisy chain to consider the effect of reliability test. The electrical resistance was measured before and after reliability test. Based on these measurement, failure mode resulted from the moisture absorption was studied using scanning acoustic microscope. To achieve an optimum reflow profile of solder bump, correct temperature profile was set up with respect to the resin base flux. Different bonding forces were tested. Four underfill encapsulants were evaluated for minimum voids that caused the severe defects after reliability test. Also, the gap heights were measured with respect to applied bonding force after underfill was performed. Results from the moisture absorption and thermal cycling were discussed for flip-chip bonding on BT-resin substrates. The test vehicles using flip-chip technology have passed moisture preconditioning and temperature cycling tests.

Paper Details

Date Published: 18 August 1997
PDF: 8 pages
Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); doi: 10.1117/12.280566
Show Author Affiliations
Dong Hyeon Jang, Samsung Electronics Co., Ltd. (South Korea)
Sa Yoon Kang, Samsung Electronics Co., Ltd. (South Korea)
Y. M. Lee, Samsung Electronics Co., Ltd. (South Korea)
S. Y. Oh, Samsung Electronics Co., Ltd. (South Korea)


Published in SPIE Proceedings Vol. 3184:
Microelectronic Packaging and Laser Processing
Yong Khim Swee; HongYu Zheng; Ray T. Chen, Editor(s)

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