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Proceedings Paper

Reversible low-temperature direct bonds for fabrication of three-dimensional microelectronic structures
Author(s): Robert W. Bower; Albert Li
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Paper Abstract

This paper describes the formation and application of reversible low temperature bonds for fabrication of 3D microelectronic structures. The basis of this reversible bond is a three-step low temperature bonding process. This tree-step process consists of 1) pressure, 2) pressure and temperature and 3) temperature. The first and second steps of this process create a uniform, void free, weak bond that can be easily severed. The third step consists of a long anneal at 200 degrees C that creates a bond of strength greater than 1000 ergs/cm2. The reversibility and reusability of a bond processed through the first and second step of the three-step process is investigated in this paper.

Paper Details

Date Published: 18 August 1997
PDF: 4 pages
Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); doi: 10.1117/12.280562
Show Author Affiliations
Robert W. Bower, Univ. of California/Davis (United States)
Albert Li, Univ. of California/Davis (United States)

Published in SPIE Proceedings Vol. 3184:
Microelectronic Packaging and Laser Processing
Yong Khim Swee; HongYu Zheng; Ray T. Chen, Editor(s)

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