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Proceedings Paper

Preparation, structure, and properties of aluminium nitride (AIN) reinforced polymer composites: alternative substrate materials for microelectronic packaging
Author(s): Xiao Hu; Juay Sim Koh; Peter Hing
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Paper Abstract

A series of composite materials of varying compositions based on a high temperature resistance engineering thermotropic liquid crystalline polymer and particulate aluminium nitride (AlN) were compounded at relatively low temperature using a co-rotating twin screw extruder/compounder equipped with the segmented screws. The compounded composites are injection molded into different shapes, i.e., dumbbell, rectangular bar and cylindrical disk, for various physical and mechanical tests. In particular, detailed study was carried out to understand the effect of AlN on the dielectric constant, thermal conductivity and thermal expansion behavior of these materials. Results have shown that the thermal conductivity steadily increases with AlN filler concentration. An increase by about 80 percent in thermal conductivity of the composite materials is achieved as compared to the unfilled polymer. The dielectric constants of these composites were found to increase with filer content and range from 3.6 to 5.0 at 1 kHz and 3.0 to 4.2 at 10 MHz. Substantial reductio in thermal expansion coefficient was also achieved in the composite materials. Attempt has been made to correlate the experimental data with composite theories.

Paper Details

Date Published: 18 August 1997
PDF: 9 pages
Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); doi: 10.1117/12.280556
Show Author Affiliations
Xiao Hu, Nanyang Technological Univ. (Singapore)
Juay Sim Koh, Nanyang Technological Univ. (Singapore)
Peter Hing, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 3184:
Microelectronic Packaging and Laser Processing
Yong Khim Swee; HongYu Zheng; Ray T. Chen, Editor(s)

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