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Proceedings Paper

Precision molding techniques for optical waveguide devices
Author(s): Stefan Kalveram; Andreas Neyer
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Paper Abstract

Single-mode optical waveguide devices with integrated fiber- alignment grooves have been fabricated by injection molding of structured substrates and by subsequent filling of the waveguide channels with higher refractive index polymer. The master forms of the microstructures have been micro-machined channels with higher refractive index polymers. The master forms of the microstructures have been micro-machined in silicon. A special injection molding tool has been developed to yield plastic substrate chips with high surface planarity and replicated microstructures with details in the submicron range. Hot embossing is a further technology applied for the fabrication of large area waveguide devices with integrated mirrors, mainly intended for optical backplane applications. The hot embossing tool is driven on an injection molding machine which is a more cost effective method than the acquisition of conventional hot embossing equipment. In this paper, the injection molding as well as the hot embossing tool will be described together with the process and the results in the field of passive components for optical telecommunications and datacommunications.

Paper Details

Date Published: 22 September 1997
PDF: 10 pages
Proc. SPIE 3135, Precision Plastic Optics for Optical Storage, Displays, Imaging, and Communications, (22 September 1997); doi: 10.1117/12.279141
Show Author Affiliations
Stefan Kalveram, Univ. Dortmund (Germany)
Andreas Neyer, Univ. Dortmund (Germany)


Published in SPIE Proceedings Vol. 3135:
Precision Plastic Optics for Optical Storage, Displays, Imaging, and Communications
Werner F. Frank, Editor(s)

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