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Proceedings Paper

New mask data processing system for ULSI fabrication
Author(s): Ryuji Takenouchi; Hidetoshi Ohnuma; Isao Ashida; Satoru Nozawa
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Paper Abstract

A new mask data processing system which significantly reduces overhead time in internal data handling and total elapsed processing time has been developed. This system is designed with a new compact mask pattern database architecture, where all mask data processing steps are performed. Using this system, the total elapsed processing time of geometrical operations, optical proximity effect correction (OPC) and electron beam (EB) exposure system data conversion were improved by a factor of 3.7 compared to a conventional system. The actual processing time for a wiring layer of a 0.25 micrometer device was 3.5 hours. In this paper, details of the system design and application for actual 0.25 micrometer devices are further discussed.

Paper Details

Date Published: 28 July 1997
PDF: 10 pages
Proc. SPIE 3096, Photomask and X-Ray Mask Technology IV, (28 July 1997); doi: 10.1117/12.277293
Show Author Affiliations
Ryuji Takenouchi, Sony Corp. (Japan)
Hidetoshi Ohnuma, Sony Corp. (Japan)
Isao Ashida, Sony Corp. (Japan)
Satoru Nozawa, Sony Corp. (Japan)


Published in SPIE Proceedings Vol. 3096:
Photomask and X-Ray Mask Technology IV
Naoaki Aizaki, Editor(s)

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