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Proceedings Paper

Dry etching with consideration to thicker reticle size
Author(s): Eiichi Hoshino; Hideaki Hasegawa; Kunio Shishido; Nobuyuki Yoshioka; Satoshi Aoyama; Atsushi Hayashi; Takaei Sasaki; Michael Hiroyuki Iso; Yasuo Tokoro
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Paper Abstract

Studies of dry etching in consideration of thicker reticle size which was expected to be adopted for next reticle size were investigated with simulated plates. CD variation due to blanks thickness was evaluated in both of an electron beam and a laser beam reticle process with MoSiON embedded phase shift mask blanks by using a modifying magnetically enhanced RIE system (MEPS-6025) based on a method to predict surface voltage (Fig. 2). As blanks thickness increased up to 12.7 mm, CD variations were changed respectively (Fig. 5 and 6) along with surface bias voltage of blanks in discharge (Fig. 4). It was found that a bias voltage contribution between center and corner of the plate became closer corresponding to thickness of reticles size. Under this condition, 9 mm in thickness was found to be acceptable for dry etching process, because the effect of thickness may make discharge localize near by the substrate surface but any reason to deteriorate CDs could not appear in this feasibility study.

Paper Details

Date Published: 28 July 1997
PDF: 6 pages
Proc. SPIE 3096, Photomask and X-Ray Mask Technology IV, (28 July 1997); doi: 10.1117/12.277254
Show Author Affiliations
Eiichi Hoshino, Fujitsu Ltd. (Japan)
Hideaki Hasegawa, Fujitsu Ltd. (Japan)
Kunio Shishido, Fujitsu Ltd. (Japan)
Nobuyuki Yoshioka, Mitsubishi Electric Corp. (Japan)
Satoshi Aoyama, Mitsubishi Electric Corp. (Japan)
Atsushi Hayashi, Ulvac Coating Corp. (Japan)
Takaei Sasaki, Ulvac Coating Corp. (Japan)
Michael Hiroyuki Iso, Ulvac Coating Corp. (Japan)
Yasuo Tokoro, Ulvac Coating Corp. (Japan)


Published in SPIE Proceedings Vol. 3096:
Photomask and X-Ray Mask Technology IV
Naoaki Aizaki, Editor(s)

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