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Proceedings Paper

Photomask fabrication feasibility for next-generation reticle format
Author(s): Mikio Katsumata; Hiroichi Kawahira; Satoru Nozawa
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Paper Abstract

A next reticle format is considered from a view point of photomask fabrication process. In order to determine optimal reticle thickness corresponding to 230 mm size, processes feasibility for the thickness are examined. Cr dry etching is studied in terms of plasma condition and patterning accuracy. It is found that Cr dry etching with accurate critical dimension (CD) control is possible with substrate as thick as 12.7 mm. Post exposure bake (PEB) process for chemically amplified (CA) resists is also examined in terms of CD uniformity on substrates. Relationship of substrate thickness and CD uniformity is estimated with PEB controllability and CA resists characteristics. In addition to this, it is demonstrated that actual temperature uniformity for substrate with a thickness of 9 mm is equivalent to that for a present thickness of 6.35 mm. From these results in overall, it is proposed that substrate thickness of 9 mm is feasible for actual photomask production.

Paper Details

Date Published: 28 July 1997
PDF: 8 pages
Proc. SPIE 3096, Photomask and X-Ray Mask Technology IV, (28 July 1997); doi: 10.1117/12.277253
Show Author Affiliations
Mikio Katsumata, Sony Corp. (Japan)
Hiroichi Kawahira, Sony Corp. (Japan)
Satoru Nozawa, Sony Corp. (Japan)

Published in SPIE Proceedings Vol. 3096:
Photomask and X-Ray Mask Technology IV
Naoaki Aizaki, Editor(s)

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