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Proceedings Paper

Conformal load-bearing antenna structures (CLAS): initiative for multiple military and commercial applications
Author(s): Allen J. Lockyer; Kevin H. Alt; Jayanth N. Kudva; Robert W. Kinslow; Allan C. Goetz
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Paper Abstract

The Structures Division of the Air Force's Wright Laboratory is sponsoring the development and demonstration of a new high pay-off technology termed CLAS--Conformal Load Bearing Antenna Structures. Northrop Grumman Corporation and TRW/ASD are developing the technology under the `Smart-Skin Structure Technology Demonstration (S3D)' program, contract, No. F33615-93-C-3200. The program goal is to design, develop, fabricate, and test a CLAS component and lay the foundation for future work where potential benefits from structurally integrated antennas may be realized. Key issues will focus but are not limited to the design, structures, and manufacturing aspects of antenna embedment into load bearing aircraft structures. Results from Phase 1 of the program have been previously reported, where initial pay-offs in reducing overall airframe acquisition and support cost, weight, signature, and drag were quantitatively and qualitatively identified. A full-sized CLAS component, featuring a broadband multi-arm spiral embedded in sandwich stiffened structure, will be fabricated and tested for static strength, durability, and damage tolerance. Basic electrical performance, (e.g., radiation patterns, gain, and impedance) will also be verified; however, extensive electrical validation will be the subject of further work. Key aspects of the work and progress to date are detailed below. Also covered are future projections of CLAS technology expansion beyond tactical aircraft into other military products highlighting ships, army vehicles, and `spin-off' commercial applications to civil aircraft and the automotive industry.

Paper Details

Date Published: 19 June 1997
PDF: 15 pages
Proc. SPIE 3046, Smart Structures and Materials 1997: Smart Electronics and MEMS, (19 June 1997); doi: 10.1117/12.276607
Show Author Affiliations
Allen J. Lockyer, Northrop Grumman Corp. (United States)
Kevin H. Alt, Northrop Grumman Corp. (United States)
Jayanth N. Kudva, Northrop Grumman Corp. (United States)
Robert W. Kinslow, Northrop Grumman Corp. (United States)
Allan C. Goetz, TRW, Inc. (United States)


Published in SPIE Proceedings Vol. 3046:
Smart Structures and Materials 1997: Smart Electronics and MEMS
Vijay K. Varadan; Paul J. McWhorter, Editor(s)

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