Share Email Print

Proceedings Paper

Dislocation models for interface fracture in smart structural elements
Author(s): R. K. Nimal D. Rajapakse; Y. Zhou
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Material interfaces are commonly encountered in the fabrication of smart structural elements. Common examples are electrode-actuator-host material interfaces. Interface behavior is a very critical issue in the development of a reliable smart structure technology. This study presents a set of analytical solutions that can be used in the computational fracture mechanics analysis of interface cracks in electronic materials and in smart structural elements. Exact solutions for 2D governing equations of piezoelectric and ideal elastic media are used. Shear and opening dislocations are modeled as discontinuities in the displacements at a piezoelectric-elastic interface. The interface is assumed to be electrically insulated. Closed form solutions are developed for stress and electric fields in a bi-material system. These solutions can be used in the analysis of interface fracture problems involving smart structural elements by applying the displacement discontinuity method.

Paper Details

Date Published: 13 June 1997
PDF: 10 pages
Proc. SPIE 3039, Smart Structures and Materials 1997: Mathematics and Control in Smart Structures, (13 June 1997); doi: 10.1117/12.276581
Show Author Affiliations
R. K. Nimal D. Rajapakse, Univ. of Manitoba (Canada)
Y. Zhou, Univ. of Manitoba (Canada)

Published in SPIE Proceedings Vol. 3039:
Smart Structures and Materials 1997: Mathematics and Control in Smart Structures
Vasundara V. Varadan; Jagdish Chandra, Editor(s)

© SPIE. Terms of Use
Back to Top