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Proceedings Paper

Practical method for full-chip optical proximity correction
Author(s): J. Fung Chen; Thomas L. Laidig; Kurt E. Wampler; Roger F. Caldwell
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Paper Abstract

We describe a method for optical proximity correction (OPC) based on the principle of aerial image matching. Three basic, sub-resolution elements are used: scattering bars, anti-scattering bars, and serifs. We examine the effects of adjusting the sizes and placements of all three elements, and report the improvements achieved, in CD uniformity, printing fidelity, resolution, and depth of focus. We describe the use of a vertex-based `geometry engine' to correct very large microprocessor-style random logic chips of up to 20 million transistors. Our experience producing over 200 full-chip i-line OPC reticles, and the extensibility of the method to deep ultraviolet wavelengths, are presented.

Paper Details

Date Published: 7 July 1997
PDF: 14 pages
Proc. SPIE 3051, Optical Microlithography X, (7 July 1997); doi: 10.1117/12.276060
Show Author Affiliations
J. Fung Chen, MicroUnity Systems Engineering, Inc. (United States)
Thomas L. Laidig, MicroUnity Systems Engineering, Inc. (United States)
Kurt E. Wampler, MicroUnity Systems Engineering, Inc. (United States)
Roger F. Caldwell, MicroUnity Systems Engineering, Inc. (United States)


Published in SPIE Proceedings Vol. 3051:
Optical Microlithography X
Gene E. Fuller, Editor(s)

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