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Proceedings Paper

Temperature dependence of UV-induced compaction in fused silica
Author(s): Fan Piao; Richard E. Schenker; William G. Oldham
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Paper Abstract

Different 1995 - 1996 grade experimental fused silica samples were evaluated for their resistance to UV-induced compaction at 193 nm under elevated sample temperature conditions. Stress induced birefringence was used as a sensitive compaction monitor. We found that compaction rate decreases with increasing sample temperature. Isochronal annealing experiments were performed on two different sets of pre-damaged fused silica samples. Annealing of compaction was observed at temperatures as low as 200 degree(s)C, and an activation energy of 0.1 eV was found.

Paper Details

Date Published: 7 July 1997
PDF: 6 pages
Proc. SPIE 3051, Optical Microlithography X, (7 July 1997); doi: 10.1117/12.276046
Show Author Affiliations
Fan Piao, Univ. of California/Berkeley (United States)
Richard E. Schenker, Univ. of California/Berkeley (United States)
William G. Oldham, Univ. of California/Berkeley (United States)


Published in SPIE Proceedings Vol. 3051:
Optical Microlithography X
Gene E. Fuller, Editor(s)

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