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Proceedings Paper

Planarizing BARC 0.32-μm i-line lithography process for the reduction of intradie CD variation
Author(s): Jeffrey R. Johnson; Audrey M. Davis; Andrew E. Bair; Peter D. Nunan; Charles R. Spinner; Mark A. Spak; Ralph R. Dammel
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Paper Abstract

The effects of increasing bottom-side anti-reflective coating (BARC) thickness on the CD distribution within a device are presented. In conjunction with the increasing BARC thickness, reductions in the photoresist thickness are shown to be beneficial. Significant reductions in CD variability and increases in the depth of focus versus CD spread are achieved with increased BARC and reduced photoresist thickness. Although significant improvements are seen with a thicker BARC film for the photolithography process, the importance of optimizing the etch process for the thicker films is shown. The effects of CD distribution on important electrical device parameters are also presented.

Paper Details

Date Published: 7 July 1997
PDF: 13 pages
Proc. SPIE 3051, Optical Microlithography X, (7 July 1997); doi: 10.1117/12.276019
Show Author Affiliations
Jeffrey R. Johnson, SGS-Thomson Microelectronics (United States)
Audrey M. Davis, SGS-Thomson Microelectronics (United States)
Andrew E. Bair, SGS-Thomson Microelectronics (United States)
Peter D. Nunan, SGS-Thomson Microelectronics (United States)
Charles R. Spinner, SGS-Thomson Microelectronics (United States)
Mark A. Spak, Hoechst Celanese Corp. (United States)
Ralph R. Dammel, Hoechst Celanese Corp. (United States)

Published in SPIE Proceedings Vol. 3051:
Optical Microlithography X
Gene E. Fuller, Editor(s)

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